D-Sniper

D-Sniper

Multi-function High Speed Dispenser

Equipped with fine volume control and positional accuracy which allows it to dispense discrete dots. D-Sniper can dispense into tight locations or close to a component in very thin lines without going out of bounds. Through non-contact dispensing, problems that are brought about by conventional dispensers are completely eliminated!

DIVERSE APPLICATIONS

HIGH PROFILE IC, QFP BONDING WITH DOTS STACKING

Stackable dotting process can create high profile dotting to ensure components will be glued strongly to the PCB. No tailing effect unlike other conventional dispenser.

PTH ANTI-BRIDGING LINE DISPENSING

By jetting lines of glue between a series of PTH leads with narrow lead pitch such as connectors and sockets, solder bridging can be eliminated during wave soldering process.

CORNER BONDING

Corner bonding application can be done using our D-Sniper in a single SMT reflow process without any additional investment. SMA is dispensed on the PCB at the corners of BGA prior to placing the BGA. This application is not achievable by traditional contact dispensing as it is unable to create shapes and patterns thats adapted in Corner bonding. Through this application, there will be additional shock and bending resistance provided to the assembly when the PCB undergoes reflow.

(Photo Credits: Henkel AG & Co. KGaA) 

SMT CHIP BONDING

DOT DIAMETER 0.4MM WITH 1MM PITCH

CONFORMAL COATING

Developed to protect components from dust, vibration, moisture, & other environmental condition, offering the longest possible operational lifespan for electronic devices. Without additional investment of conventional spray coating machine, D-Sniper can be converted into a jet coating machine

UNDERFILL

With an adequate amount dispensed (the smallest mark being 0.3mm), it ensures components remain robust & safely secured. The Precision Material Weight Calibration System (Option) would ensure a consistent underfill material volume being applied to every component.

OPTIONS

DUAL LANE

With dual lane, it will reduce the process time significantly, enhancing the throughput performance. It greatly aids in automated & high-mix production environment.

DUAL VALVE

Dual Valve is capable of simultaneous dispensing with automatic pitch adjustment. Also, it can provide independent dispensing with different material. With dual valve, it will reduce the process time significantly, enhancing the throughput performance. It greatly aids in automated & high-mix production environment.

VALAVE ROTATION & TILTING MECHANISM

With the self-integrated turning unit, it’s furnished with the ability of turning the nozzle to support angular position dispensing.

SPECIFICATIONS
Dimension (W x D x H) 998 mm x 1,300 mm x 1,450 mm
Dispense Area (min.) 50 mm x 50 mm
Dispense Area (max.) 510 mm x 510mm
Placement Accuracy ± 20 micron @ 3 sigma
Repeatability ± 20 micron @ 3 sigma
Power Supply 2.4kW 220V 50/60HZ
Compress Air Supply 4 ~ 6Kgf/cm²
Control Method Industrial PC + Motion Control Card
STANDARD FEATURES
Height Measurement System by laser
Air Stabilizer
Auto nozzle vacuum cleaning function
Single Stage Conveyor
IC Body Recognition
Valve Temperature Regulators
Fluid Level Detection & Alarm
Statistical Process Control
XYZ Origin Calibration Platform
Programming method: Online teaching or import from CAD file
OPTIONS
Precision Material Weight Calibration System
Dual Lane Conveyor System
Substrate Bottom Heating Module
Valve Rotation & Tilting Mechanism
Substrate Auto Loader/Unloader
3 Stage Conveyors with Substrate Bottom Heating Module
Dual Valve Structure (Can perform Simultaneous Dispensing of 2 PCB)

Call us at +65 6547 8065 or fill in the enquiry form below

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